Technical specifications:
- Operating frequency: 2.4 GHz (RF / Bluetooth Low Energy)
- Communication support:
- Transmission (TX)
- Transmission and reception (TX/RX)
- Bluetooth Low Energy (BLE)
- Available versions:
- RF chip without MCU
- SoC with integrated MCU
- Complete BLE modules
- Power supply: 1.8V – 3.6VDC
- Low power consumption (sleep mode down to a few µA)
- Memory (depending on model):
- Up to 512KB Flash
- Up to 160KB RAM
- Integrated EEPROM (some models)
- Interfaces: serial TTL
- Support for BLE Mesh networking
- Antenna: integrated PCB
- Package: compact SMT modules (e.g. 22.5 x 13.5 mm)
BT Modules
Hi-Flying Bluetooth Modules are designed for IoT, embedded applications and short-range wireless communication systems, ideal for companies developing devices with integrated connectivity and low power consumption.
The range includes RF chips, SoCs and Bluetooth Low Energy (BLE) modules at 2.4 GHz, available in various configurations with or without integrated MCU, to suit different design requirements. Hi-Flying solutions enable reliable wireless communication, in both simple transmission and bidirectional modes, with support for the latest BLE technologies.
Thanks to low power consumption, compact dimensions and ease of integration, these modules are particularly suited for industrial applications, smart devices, automation and distributed IoT systems.
Consystem supports companies in Italy in the development of embedded and wireless projects, offering Hi-Flying solutions optimized to ensure reliability, fast integration and reduced time-to-market.